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1 publication date: july 2010 ver. aeb data sheet part no. package code no. ssmini-5dc AN26018A
AN26018A 2 ver. aeb contents ? overview ???????????????????.??????????????????????. 3 ? features ???????????????????.??????????????????????. 3 ? applications ??????????????????.??????????????????????. 3 ? package ???????????????????.??????????????????????. 3 ? type ?????????????????????.??????????????????????. 3 ? application circuit example (block diagram) ????.?????????????????????? 4 ? pin descriptions ????????????????.??????????????????????. 5 ? absolute maximum ratings ????????????????.????????????????. 6 ? operating supply voltage r ange ???????????????.?? ?????????????. 6 ? allowable voltage range ???? ???????????? ???????????? ??????. 7 ? electrical characteristics ??????????????????????????????????. 8 ? electrical characteristics (reference values for design) ????????????.?????????. 10 ? control pins mode table ???? ???????.?????????? ?????????????. 11 ? truth table ????????????????????????????????????????. 11 ? technical data ??????????????????????????????????????.. 12 y p d ? t a diagram ?????????????????????????????????????. 12 ? usage notes ????????????????? ??.????????? ???????????? 13
AN26018A 3 ver. aeb AN26018A lna ic for uhf band (400 mh z to 800 mhz) applications ? overview y AN26018A is lna-ic for uhf band (400 mhz to 800 mhz) applications. y realizing high performance by using sige bi-cmos process (f t = 90 ghz, f max = 140 ghz). y high/low gain-mode is changeable, contro lled by integrated cmos logic circuit. y achieving miniaturization by using small size package. ? features y low voltage operation +2.85 v typ. y low current consumption 3.0 ma typ. (high-gain mode) 0.1 a typ. (low-gain mode) y high gain 14.5 db typ. frx = 620 mhz (high-gain mode) y low noise figure 1.50 db typ. frx = 620 mhz (high-gain mode) y low distortion ?8.0 dbm typ. frx = 620 mhz (high-gain mode) (iip3 +10 mhz offset) y small package ? applications y uhf band (400 mhz to 800 mhz) applications ? package y 5 pin plastic small surface mount package (smini type) ? type y bi-cmos ic
AN26018A 4 ver. aeb ? application circuit example (block diagram) in out v cc c1 54 123 out in gnd cnt (gain control) v cc l1 c2 c3 notes) y this application circuit is shown as an example but does not guarantee the design for mass production set. y this block diagram is for explaining functions. the part of the block diagram may be omitted, or it may be simplified. y external components : see page 15
AN26018A 5 ver. aeb ? pin descriptions rf output output out 5 v cc power supply v cc 4 high-gain / low-gain sw input cnt 3 gnd ground gnd 2 rf input input in 1 description type pin name pin no.
AN26018A 6 ver. aeb ? absolute maximum ratings ? operating supply voltage range ? ma 18 i cc supply current 2 notes unit rating symbol parameter a no. *3 c ?40 to +125 t stg storage temperature 5 *3 c ?20 to +70 t opr operating ambient temperature 4 *2 mw 66 p d power dissipation 3 *1 v 3.6 v cc supply voltage 1 notes unit range symbol parameter * v 2.70 to 3.00 v cc supply voltage range notes) *1 : the values under the condition not exceeding the above absolute maximum ratings and the power dissipation. *2 : the power dissipation shown is the value at t a = 70 c for the independent (unmounted) ic package. when using this ic, refer to the ? p d -t a diagram in the ? technical data and design the heat radiati on with sufficient ma rgin so that the allowable value might not be exceeded based on the conditi ons of power supply voltage, load, and ambient temperature. *3 : except for the power dissipation, operating ambient temp erature, and storage temperature, all ratings are for t a = 25 c. note) * : the values under the condition not exceeding the above absolute maximum ratings and the power dissipation note) absolute maximum ratings are limit values which are not dest ructed, and are not the values to which operation is guarantee d.
AN26018A 7 ver. aeb ? allowable voltage range notes) y allowable current and voltage ranges are limit ranges which do not result in damages to this ic, and ic operation is not guaran teed within these limit ranges. y do not apply voltage to n.c. pins. y voltage values are with respect to the gnd. y applying external voltage to any pin not mentioned below leads to the malfunc tion and the damage of the device. y below ratings are specified for prevention of malf unction and stress, not for guaranteed operation. *2 v 0 gnd 2 ? in notes unit rating pin name pin no. *3 v ?0.3 to (v cc ) out 5 ? v ?0.3 to (v cc ) cnt 3 *1 v 1 notes) *1 : rf signal input pin. do not apply dc current. *2 : same as gnd pin. *3 : rf signal output pin. do not apply dc current.
AN26018A 8 ver. aeb ? electrical characteristics at v cc = 2.85 v note) t a = 25 c 2 c unless otherwise specified. ? v 0.55 0.0 ? ? vil input voltage (low-gain mode) dc-4 current at cnt pin vih = v cc v cc current at low-gain mode no input signal ? v ? 2.85 1.40 ? vih input voltage (high-gain mode) dc-3 ? a 40 11 ? iih sw current (high) dc-5 dc electrical characteristics ? ma 4.0 3.0 ? v cc current at high-gain mode no input signal i cc h supply current hg dc-1 ? a 9.5 0.1 ? i cc l supply current lg dc-2 limits typ unit max notes min conditions symbol parameter b no.
AN26018A 9 ver. aeb ? electrical characteristics (continued) at v cc = 2.85 v note) t a = 25 c 2 c, frx = 620 mhz, prx = ?30 dbm, cw unless otherwise specified. ? db ? ?1.5 ?2.0 low-gain mode f = frx, prx = ?20 dbm gls power gain lg a-2 f1 = frx + 10 mhz f2 = frx + 20 mhz input 2 signals (f1, f2) ? dbm ? ?8.0 ?14.5 iip31s iip3 +10 mhz offset a-3 lna ac electrical characteristics ? db 16.5 14.5 12.5 high-gain mode f = frx ghs power gain hg a-1 limits typ unit max notes min conditions symbol parameter b no.
AN26018A 10 ver. aeb ? electrical characteristics (reference values for design) at v cc = 2.85 v notes) t a = 25 c 2 c, frx = 470 mhz, 620 mhz, 770 mhz, prx = ?30 dbm, cw unless otherwise specified. the characteristics listed below are reference values derived fr om the design of the ic and are not guaranteed by inspection. if a problem does occur related to these characteris tics, we will respond in good faith to user concerns. ? ? ? 1.5 1.0 high-gain mode f = 300 khz to 6 ghz kh k-factor c-14 ? db ? 12 10 low-gain mode f = frx s22l output return loss lg c-13 ? db ? 23 7 high-gain mode f = frx s22h output return loss hg c-12 ? db ? 20 12 low-gain mode f = frx s11l input return loss lg c-11 ? dbm ? ?5 ?11 high-gain mode f = frx ip1dbh input p1db c-7 ? db ? 9.5 5.0 high-gain mode f = frx s11h input return loss hg c-10 ? s 10.0 3.2 ? high-gain mode low-gain mode low-gain mode high-gain mode tsw switching time c-15 low-gain mode f = frx high-gain mode f1 = frx ? 10 mhz f2 = frx ? 20 mhz input 2 signals (f1, f2) low-gain mode f = frx low-gain mode f = frx, prx = ?20 dbm *1 db 1.9 1.5 ? high-gain mode f = frx nfh noise figure hg c-3 ? db 2.5 1.5 ? nfl noise figure lg c-4 ? dbm ? ?8.0 ?16.5 high-gain mode f1 = frx + 10 mhz f2 = frx + 20 mhz input 2 signals (f1, f2) iip3h1 iip3 +10 mhz offset hg c-5 ? dbm ? ?8.5 ?17.0 iip3h2 iip3 ?10 mhz offset hg c-6 ? db ?18 ?24 ? high-gain mode f = frx isoh reverse isolation hg c-8 lna ac electrical characteristics ? db 17.0 14.5 12.0 high-gain mode f = frx gh power gain hg c-1 ? db ? ?1.5 ?2.5 gl power gain lg c-2 ? db ?1.0 ?1.6 ? isol reverse isolation lg c-9 reference values typ unit max notes min conditions symbol parameter b no. note) *1 : connector & pattern (evaluation pcb) loss (0.1 db) included.
AN26018A 11 ver. aeb ? control pins mode table note) control voltage range : see b no. dc-3 / b no. dc-4 at page 8 ? truth table note) control voltage range : see b no. dc-3 / b no. dc-4 at page 8 voltage high-gain high ? low-gain high-gain/low-gain switching (gain control) 3 note low descriptions pin no. high-gain high-gain high mode lna cnt low-gain low-gain low
AN26018A 12 ver. aeb ? technical data y p d ? t a diagram
AN26018A 13 ver. aeb ? usage notes y special attention and precaution in using 1. this ic is intended to be used for ge neral electronic equipment [cellular phones]. consult our sales staff in advance for in formation on the foll owing applications: x special applications in which ex ceptional quality and reli ability are required, or if the fail ure or malfunction of this ic may directly jeopardize life or harm the human body. x any applications other than the standard applications intended. (1) space appliance (such as artificial satellite, and rocket) (2) traffic control equipment (such as fo r automobile, airplane, train, and ship) (3) medical equipment for life support (4) submarine transponder (5) control equipment for power plant (6) disaster prevention and security device (7) weapon (8) others : applications of which reliability equivalent to (1) to (7) is required 2. pay attention to the direction of lsi. when mounting it in the wrong direction onto the pcb (printed-circuit-board), it might smoke or ignite. 3. pay attention in the pcb (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins. in addition, refer to the pin description for the pin configuration. 4. perform a visual inspection on the pcb be fore applying power, otherwise damage might happen due to problems such as a solder- bridge between the pins of the semiconductor device. also, perfo rm a full technical verification on the assembly quality, becau se the same damage possibly can happen due to conductive substanc es, such as solder ball, that adhere to the lsi during transportation. 5. take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs such as output pin- v cc short (power supply fault), output pin-gnd short (ground fault), or output-to-output-pin short (load short) . and, safety measures such as an installation of fuses are recommended because the extent of the above-mentioned damage and smoke emission will depend on the current capability of the power supply. 6. when designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage a nd operating environment etc.). esp ecially, please be careful not to exceed the range of absolu te maximum rating on the transient state, such as power-on, power-off and mode -switching. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, ta ke into the consideration of incidence of break down and failur e mode, possible to occur to semiconductor produc ts. measures on the system s such as redundant design, arresting the spread of fi re or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the produ cts. 7. when using the lsi for new models, verify the safe ty including the long-term reliability for each product. 8. when the application system is designed by using this lsi, be sure to confirm notes in this book. be sure to read the notes to descriptions and the usage notes in the book.
request for your special attention and precautions in using the technical information and semiconductors described in this book (1) if any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) the technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. no license is granted in and to any intellectual property right or other right owned by panasonic corporation or any other company. therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) the products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. it is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) the products and product specifications described in this book are subject to change without notice for modification and/or im- provement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (5) when designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (esd, eos, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. when using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) this book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202

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